OLED device and encapsulating method thereof

一种oled器件的封装方法及一种oled器件

Abstract

本发明所述的OLED器件的封装方法及一种OLED器件,通过合理设置密封框的高度、支撑体的高度和OLED器件发光单元的高度值,能够保证当封装盖板盖在OLED器件上时,支撑体与OLED器件可以有效接触却不会产生太大的压力而对OLED器件造成损坏。而封装盖板本身是单层结构,直接在封装盖板上制备支撑体的工艺相对于在多层结构的OLED器件上的制备工艺来说,可以大大降低工艺难度以及成本。
The invention relates to an OLED device and an encapsulating method thereof. By reasonably setting the height of sealing frames, the height of supporting bodies and the height value of an OLED device light emitting unit, it can be guaranteed that when the OLED device is covered with an encapsulating cover plate, the supporting bodies can make effective contact with the OLED device but too much pressure cannot be generated to damage the OLED device. Besides, the encapsulating cover plate is of a single-layer structure, so difficulty and cost of the process that the supporting bodies are directly manufactured on the encapsulating cover plate can be greatly reduced compared with the process that the supporting bodies are manufactured on the OLED device of a multi-layer structure.

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Cited By (1)

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