Anti-nitridation process for copper-tin composite plating

一种铜锡复合镀防渗氮工艺

Abstract

本发明公开了一种铜锡复合镀防渗氮工艺,该工艺首先将工件除油、清洗后,再采用硫酸对工件进行弱腐蚀处理;将工件进行阳极清洗,阳极清洗后工件需带电出槽;进行预镀镍:预镀镍前工件不通电并停放在电镀液中2~4min,然后预镀镍1um,再镀暗镍1~2um;采用硫酸对工件进行活化处理;然后再无氰电镀铜,在工件电镀铜层的表面再镀暗锡,最后进行稳定化处理。采用本发明的电镀工艺使工件可在较薄的铜镀层的情况下,同样能达到防止渗氮、碳、氰的目的,这样不仅能够降低铜镀层的厚度,节约耗铜量,而且减少电镀时间,提高电镀效率。
The invention discloses an anti-nitridation process for copper-tin composite plating, which comprises the following steps: deoiling and cleaning a workpiece, and then performing weak corrosion treatment on the workpiece with sulfuric acid; performing anodic cleaning on the workpiece, wherein the workpiece subjected to anodic cleaning needs to be taken out of the tank while electrified; performing nickel preplating: keeping the workpiece non-electrified and placing the workpiece in an electroplating solution for 2-4 minutes before nickel preplating, then preplating nickel for 1 mu m, and plating dark nickel for 1-2 mu m; performing activating treatment on the workpiece with sulfuric acid; and performing copper cyanideless electroplating, plating dark tin on the surface of the copper-electroplated layer of the workpiece, and finally performing stabilizing treatment. According to the electroplating process disclosed by the invention, the workpiece can similarly achieve the purpose of preventing nitridation, carburization and cyanogen infiltration in case of a thinner copper-plated layer, thus reducing the thickness of the copper-plated layer, reducing the copper consumption, shortening the electroplating time and improving the electroplating efficiency.

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (6)

    Publication numberPublication dateAssigneeTitle
    CN-101698475-AApril 28, 2010广东光华化学厂有限公司Preparation method of electronic grade high-purity copper pyrophosphate
    CN-101942682-AJanuary 12, 2011重庆长安工业(集团)有限责任公司一种在具有深/盲孔的异形钢件上镀铜的工艺及专用设备
    CN-103233234-AAugust 07, 2013哈尔滨飞机工业集团有限责任公司Partial copper plating method for part
    CN-103726081-AApril 16, 2014哈尔滨辰能工大环保科技股份有限公司一种改善防渗碳铜膜的无氰碱性镀铜制备方法
    US-4082591-AApril 04, 1978Mitsui-Anaconda Electro Copper Sheet Co., Ltd.Surface treatment process for copper foil
    US-5814202-ASeptember 29, 1998Usx CorporationElectrolytic tin plating process with reduced sludge production

NO-Patent Citations (2)

    Title
    詹兴刚: "酸性镀锡工艺研究及其应用", 《2010’(贵阳)低碳环保表面工程学术论坛论文集》
    钟云等: "电镀铜锡合金工艺研究进展", 《电镀与环保》

Cited By (0)

    Publication numberPublication dateAssigneeTitle